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- Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Shao-Chin Tseng, Mau-Tsu Tang, Ching-Yu Chiang, C. R. Kao, and Cheng-En Ho, “Synchrotron X-ray Study of Electromigration, Whisker Growth, and Residual Strain Evolution in a Sn Blech Structure,” Scripta Materialia, 214, 114682 (2022). (IF: 5; Ranking: 6.3%)
- Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C. Robert Kao, and Cheng-En Ho, “Synchrotron White Laue Nanodiffraction Study on the Allotropic Phase Transformation between Hexagonal and Monoclinic Cu6Sn5,” Journal of Materials Research and Technology, 13, 1316–1322 (2021). (IF: 5.039; Ranking: 8.5%)
- Ying-Syuan Wu, Pei-Tzu Lee, Wan-Zhen Hsieh, Tsai-Tung Kuo, and Cheng-En Ho, “Interfacial Reaction and Mechanical Reliability between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad,” Surface and Coatings Technology, 359, 374–383 (2019). (IF: 3.192; Ranking: 26.3%)
- Yu-Hsuan Huang, Wan-Zhen Hsieh, Pei-Tzu Lee, Ying-Syuan Wu, Tsai-Tung Kuo, and Cheng-En Ho, “Reaction of Au/Pd/Cu and Au/Pd/Au/Cu Multilayers with Sn-Ag-Cu Alloy,” Surface and Coatings Technology, 358, 753–761, (2019). (IF: 3.192; Ranking: 26.3%)
- Cheng-En Ho, Chang-Chih Chen, Cheng-Hsien Yang, Pei-Tzu Lee, Wan-Zhen Hsieh, and Ying-Syuan Wu, “TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in A Cu Film,” Surface and Coatings Technology, 350, 1010–1019 (2018). (IF: 3.192; Ranking: 26.3%)
- Cheng-En Ho, Wan-Zhen Hsieh, Pei-Tzu Lee, Yu-Hsuan Huang, and Tsai-Tung Kuo, “High-temperature Stability of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes,” Applied Surface Science, 434, 1353–1360 (2018). (IF: 5.155; Ranking: 5%)
- Pei-Tzu Lee, Yu-Hsuan Huang, Ping-Chou Lin, Chang-Chih Chen, Wan-Zhen Hsieh, and Cheng-En Ho, “High-speed Cu Electrodeposition and Its Solderability,” Surface and Coatings Technology, 320, 559–567 (2017). (IF: 2.906; Ranking: 21%)
- Cheng-En Ho, Wan-Zhen Hsieh, Cheng-Hsien Yang, and Pei-Tzu Lee, “Real-time Study of Electromigration in Sn Blech Structure,” Applied Surface Science, 388, 339–344 (2016). (IF: 3.387; Ranking: 5.3%)
- Pei-Tzu Lee, Wan-Zhen Hsieh, Ting-Chun Yeh, Hsiao-Keng Wang, and Cheng-En Ho, “Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications,” Surface and Coatings Technology, 303, 103–111, (2016). (IF: 2.589; Ranking: 21%)
- Wan-Zhen Hsieh, Md Arifur Rahman, Tsung-Hsun Yang, Tsai-Tung Kuo, and Cheng-En Ho, “Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films,” Surface and Coatings Technology, 303, 112–118 (2016). (IF: 2.589; Ranking: 21%)
- Cheng-En Ho, Wan-Zhen Hsieh, and Tsung-Hsun Yang, “Depletion and Phase Transformation of A Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu,” Electronic Materials Letters, 11(1), 155–163 (2015). (IF: 2.507; Ranking: 39.9%)
- Cheng-En Ho, Wan-Zhen Hsieh, Cheng-Hsien Yang, Ting-Chun Yeh, and Tsai-Tung Kuo, “Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition,” Journal of Electronic Materials, 44(1), 568–580 (2015). (IF: 1.491; Ranking: 42.4%)
- Cheng-En Ho, Wan-Zhen Hsieh, Chao-Sheng Liu, and Cheng-Hsien Yang, “Theoretical and Experimental Determination of Cu Diffusivity in Eutectic Sn-Ag System at 235–280 °C,” Thin Solid Films, 572, 238–244 (2014). (IF: 1.759; Ranking: 35.3%)
- Cheng-En Ho, Chia-Wei Fan, and Wan-Zhen Hsieh, “Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction and High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System,” Surface and Coatings Technology, 259(B), 244–251 (2014). (IF: 1.998; Ranking: 29.4%)
- Cheng-En Ho, Wan-Zhen Hsieh, Chang-Chih Chen, and Ming-Kai Lu, “Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode,” Surface and Coatings Technology, 259(B), 262–267, (2014). (IF: 1.998; Ranking: 29.4%)
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