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Beam currentIon implantationUltra-shallow junctionUV RamanX-ray photoelectron spectroscopy (XPS)X-ray adsorption near edge structure (XANES)
Damage and Annealing Recovery of Boron-implanted Ultra-shallow Junction: the Correlation between Beam Current and Surface Configuration
~F.-M. Chang, Z.-Z. Wu, Y.-F. Lin, L.-C. Kao, C.-T. Wu, S.-K. JangJian, Y.-N. Chen, and K. Y. Lo*
~The condition of the beam current in the implantation process is a key issue in the damage rate and structural evolution in the sequent annealing process, especially for ultra-shallow layers. In this work, we develop a compensative optical method combined with UV Raman, X-ray photoelectron spectroscopy (XPS), and X-ray absorption near edge spectroscopy (XANES) to inspect the influence of the beam current in the implantation process. The optima condition of the beam current in the implantation process is determined by higher effective Si-B bond portion in UV Raman spectra and less the peak of B–B bond in XPS spectra which is caused by B cluster defects. Results of XANES indicate that the B oxide layer is formed on the surface of the ultra-shallow junction. The defects in the ultra-shallow junction after annealing are analyzed by novel optical analyses, which cannot be inspected by a traditional thermal wave and resistance measurement. This work exhibits the structural variation of the ultra-shallow junction via a variant beam current and provides a valuable metrology in examining the chemical states and the effective activation in the implantation technology.